IT, Mobile Technology
Semiconductor & Mobile
TEST JIG
We develop precision test jigs for testing mobile semiconductor components, tailored to meet our customers’ specific needs.
Our test jigs are precisely designed and manufactured to replicate real-world production environments as closely as possible when testing various IT devices and semiconductor components. This enables pre-production validation of potential defects before mass production, while making it easier to identify and analyze specific failure conditions.
| Key Test Products |
-
Application Processor
-
Power Module
-
RFIC & Module
-
WiFi /BT
-
Memory IC
-
GPS
-
NFC
-
Senser
-
Codec
-
Wireless Charging
-
Pre-production validation of specific defects
-
Easy identification and analysis of specific failure conditions
-
Oscilloscope measurement of specific device points requested by customers via a Proving Board
-
Real-time measurement of voltage, current, and I/O data on key pins
-
System-level testing for production validation
-
Supports fine-pitch applications down to 0.2 mm
-
Cost reduction through dual- or triple-socket configurations
| PACKAGE TYPE |
-
BGA LGA
-
QFN
-
QFP
-
CSP
-
TSOP
-
SOP
-
Senser
TEST SOCKET
We provide tailored solutions to meet our customers’ needs, backed by extensive expertise in the design and precision machining of a wide range of test sockets.
PROBE PIN
We provide a wide range of solutions for semiconductor test probe pins, offering custom manufacturing based on customer requirements and leveraging advanced precision machining expertise.
Applications
PROBE PINS are an essential component for semiconductor testing and various IT-related testing applications.
-
Camera Module Testing
-
Display Module Testing
-
Various Test Sockets
-
Semiconductor Testing
-
LCD Inspection Equipment
-
Image Sensor Testing
-
Other IT & Semiconductor Component Testing
PROBE PIN SPEC
